Firms line up $4.4 billion investment in New York over next five years
28 Sep 2011
New York state governor Andrew M Cuomo says five chip makers including Intel, IBM, Samsung Electronics, GlobalFoundries and Taiwan Semiconductor Manufacturing Co have committed investment of $4.4 billion in research and development in the state, over the next five years. The investment is aimed at development of new 450-millimeter chip wafer technology.
Cuomo added New York secured the investment competing with other locations worldwide. Cuomo's speech was also webcast.
John Kelly, senior vice president and director of IBM Research said, the company had committed $3.6 billion of the total investment to work on next generations of computer chips, including those using 22-nanometers and 14-nanometers process technology.
IBM's investment in New York state, since 2000 had topped $10 billion, which is also its largest investment anywhere in the world.
The transition from 300 mm to 450 mm wafers would call for unprecedented industry-wide collaboration, and the New York project was critical for the new consortium, called Global 450, according to Brian Krzanich, senior vice president and general manager of manufacturing and supply chain at Intel.
The new wafers would yield roughly twice the number of chips as today's 300 mm wafers, lowering the cost of making future chips.
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