India''s first high density PCB plant coming up at Chennai

06 October 2006

Chennai: The country''s first high-density interconnections (HDI) printed circuit board (PCB) plant will come up in the Nokia Telecom Special Economic Zone, Sriperumbudur near Chennai.

It is going to be put up by Aspocomp (India) Co Ltd, the Indian subsidiary of the Finnish Aspocomp Group, the €75-million plant, and is expected to be operational during the second half of 2007 though full production will start only in 2008.

The plant will initially stamp out 50 million pieces (over 2 lakh per day) and later scale up production based on the demand.

The €154- million turnover Finnish group has followed its major global customers (Nokia, Flextronics, Motorola, Alcatel, Sanmina-SCI and others) who have set up production bases in India.

"The Chennai facility will turn out to be largest Aspocomp plant for the group in the world as we intend to double our initial investment," says president and CEO Maija Liisa Friman, Aspocomp Group Oyj.

The two-phase project will first cater to the domestic market - mainly meeting Nokia''s needs — and later the needs of other mobile phone manufacturers in India, and even cater to global demand.