labels: technology, ibm, semiconductors
IBM and TDK launch joint research and development project for advanced MRAM news
20 August 2007

IBM and TDK Corporation today announced a joint research and development programme to develop high capacity magnetic random access memory (MRAM) technology utilising the spin momentum transfer effect.

The companies expect that harnessing the spin momentum transfer effect will allow a much more compact memory cell than is possible with present approaches.

The two companies will combine their respective expertise in areas of fundamental research for new memory technology and magnetic device development to create a high density, high capacity MRAM integrated circuit which can be used as standalone memory or embedded into other IC solutions.

"This collaborative initiative reinforces IBM's commitment to explore new phenomena for memory applications," said Dr T C Chen, vice president, science and technology, IBM Research. "The project will focus on creating and demonstrating advanced magnetic materials in demanding memory chip designs."

"This joint research and development will broaden the application of magnetic materials which has been TDK's core technology since 1935," said Minoru Takahashi, chief technology officer, TDK Corporation.

IBM has been a leader in the development of MRAM memory technology and a pioneer in the fundamental research and development of the magnetic tunnel junction (MTJ) and in the prediction and study of the spin momentum transfer effect upon which the memory is based.

TDK Corporation is the leader in applying MTJ technology into recording heads for hard disk drives. Both companies have extensive research and patents in design and materials for magnetic data recording.

The research work will be conducted at IBM's TJ Watson Research Centre in Yorktown Heights, New York, IBM's Almaden Research Center in San Jose, CA, IBM's ASIC Design Center in Burlington, VT and TDK's subsidiary R&D Centre in Milpitas, CA.

MRAM offers significant advantages over competing memory technologies including low power usage, high speed, unlimited endurance (read and write cycles), and inherent non-volatility (retains data without the need for continued power). Market adoption of MRAM has been limited by the inability to cost effectively increase capacity. Spin momentum transfer technology enables MRAM to significantly reduce cell size and thereby increase capacity cost-effectively while maintaining the low power, endurance and non-volatility advantages, potentially making MRAM a preferred solution for memory applications in the automotive, cell phone, handheld computing, and industrial controls.


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IBM and TDK launch joint research and development project for advanced MRAM